Cookson Electronics — Semiconductor Products Introduces No-Flow Underfill for Flip Chip Applications

ALPHARETTA, GA – July 9, 2002 — Cookson Electronics – Semiconductor Products has introduced STAYCHIPTM NUF-2076E, no-flow underfill used to perform the dual functions of a solder flux and an underfill between a flip-chip die and a substrate, or an area array device and a printed circuit board.


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