Cypress to improve manufacturing yield using WaferYield technology

Aug. 21, 2002 – San Jose, CA – Cypress Semiconductor Corp. and WaferYield, Inc. announced that Cypress has expanded its non-exclusive commercial license agreement to use WaferYield’s WAMA technology.

WAMA technology is expected to improve the yield, throughput, and profitability of Cypress’s wafer fabrication operations, according to the companies.

“In this challenging economic climate, all capital expenditures are highly scrutinized and need to be strongly justified,” said Christopher Seams, Cypress exec. VP of technology and worldwide manufacturing. “It makes much better sense to find ways to improve the yield of existing equipment. By expanding the use of WAMA technology and implementing it in all of our fabs, we look forward to seeing greater manufacturing efficiencies.”

WAMA tools are based on WaferYield’s patented, proprietary wafer-mapping WAMA technology. Each module targets a different aspect of the wafer fabrication process. WAMA modules are designed to increase gross dice, maximize good dice, maximize fab throughput, and maximize return on investment.


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