ESEC Introduces 5 µm Die Attach Solution

ESEC qualifies the placement accuracy of their high-precision Die and Flip Chip Bonders with a newly developed, 0.5 µm high-resolution measuring tool. It is capable of taking thousands of unattended measurements over the entire bond range, under production conditions. To obtain this result, ESEC has combined its ceramic beam / air bearing gantry concept with advanced motion control. The placement accuracy is effective over a work envelope of 240x200mm. “We think ESEC’s high-accuracy placement solution fulfills an important market request, specifically for optoelectronic packages, MEMS and advanced flip chip requirements,” states Andre Nipkow, Product Director for ESEC. “Where other competitive offerings are accurate only in the immediate bond region, ESEC offers 5 µm placement accuracy across a large work area. This insures more stable bonding performance and overall superior results.”

Cham/Switzerland, July 18, 2002 – ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, will be presenting a revolutionary technology based on a rotating bondhead, at the world’s largest semiconductor trade fair, Semicon West, taking place on July 17-19, 2002, in San Jose, California/USA.


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