ESEC Introduces Revolutionary Bondhead Technology at Semicon West

ESEC’s newly developed bondhead technology is based on a system that employs rotation, thereby enabling a significant increase in speed to be achieved. ESEC’s strong financial position and strategic commitment to interconnect assembly solutions has enabled it to sustain investments in research and development. Thanks to these efforts, it was also possible to increase bonding speed without a commensurate increase in motor power and not at the cost of the bonding accuracy that is so crucial in bonding. Although the new bondhead is only at the dawn of its development, a direct comparison with conventional technologies has already revealed outstanding results, both in terms of productivity and accuracy at speed. ESEC’s new innovative solution makes it possible for significantly more than 20 gold or copper wires to be bonded every second, and this with an equal or even greater degree of precision. At present, conventional machines bond up to a maximum of 16 – 18 wires per second.

CHANDLER, Ariz. and RESEARCH TRIANGLE PARK, N.C., July 18, 2002 — Amkor Technology, Inc. (Nasdaq: AMKR) and Unitive, Inc. have expanded their two-year relationship by entering into a strategic manufacturing alliance to collaborate on turn-key manufacturing services using Unitive’s wafer level packaging solutions and Amkor’s advanced ackaging and test capabilities.


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