Kulicke & Soffa Announces D2I2 A Coreless, High-Density, High-Frequency Substrate

Willow Grove, PA, July 17, 2002 Kulicke & Soffa Substrate Division is expanding their product line with the development of the D2I2, “Direct Die Interposer Interconnect” substrate. D2I2offers industry-leading electrical performance, improved wafer utilization, and is environmentally friendly.


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