Aug. 5, 2002 – Beijing, China – US telecommunications equipment maker Motorola Inc. has delayed plans to begin mass wafer production in China to the second half of this year, a company spokeswoman said.
Motorola had originally said that mass production at its $1.9 billion semiconductor plant in the northern coastal city of Tianjin would begin in 1H02, reported Reuters. That was the timetable the company set in 2000 when it outlined plans to build the wafer fabrication plant in Tianjin, she said.
Motorola’s Tianjin plant has built a production line for 200mm wafers using 0.18-micron technology. The plant would produce mostly chips for cellular phones and other communications equipment and devices.