Palomar Technologies Introduces the Gold Connection for Gold Ball Bump and Flip Chip Thermocompression Bonding

Vista, Calif. – July 17, 2002 – Palomar Technologies, the leading manufacturer of automated high-precision assembly systems for broadband communications, introduces Palomar’s Gold ConnectionTM, consisting of Palomar’s new Gold Bumper(tm) and Flip Chip TCB(tm) (Thermocompression Bonder). The Gold Connection is an integrated solution that addresses the industry’s growing need for smaller package density, increased reliability, and increased signal performance, while providing a clean, environmentally safe alternative to lead-based processes.


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