phoenix|x-ray Unveils Industry’s First Back-End Inspection Roadmap

CAMARILLO, Calif. – JULY 16, 2002 – Driven by increasing package density and device complexity, as well as continued shrinking geometries, phoenix|x-ray today launched the industry’s first comprehensive back-end x-ray inspection technology roadmap, identifying magnification and focal spot size as key issues facing today’s requirements for verification of complex packages.

Semiconductor Equipment Companies Expect $22.8 Billion Market in 2002


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