Following are some of the many innovative new products that can be seen this month at the International Microelectronics and Packaging Society (IMAPS) Symposium in Denver.
For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to (413) 637-4343, or visit www.onlinecenter.to/ap.
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Noncontact Measuring System
A two-axis noncontact measuring system combining quality control laboratory accuracy, repeatability and optical quality with ease of use, Kestrel incorporates the company's patented Dynascope optical projection technology, which provides high-contrast, high-resolution images of complex parts of various materials. Vision Engineering Inc., New Milford, Conn. For free data, circle 205 or visit www.onlinecenter.to/ap.
Signal-integrity Software
SIwave software is designed to meet the growing demand for quick and accurate signal- and power-integrity analysis of IC packages and PCBs. The software enables engineers to model PCB and package structures by using a full-wave analysis engine to generate both frequency- and time-domain results. Ansoft Corp., Pittsburgh, Pa. For free data, circle 202 or visit www.onlinecenter.to/ap.
In-line Coating System
FALCON ICS 412 is an in-line flux coating system that can process wafers from 4 to 12″ with no tool change required. The system is said to be capable of dispensing up to four process fluids and can be used as a post-reflow wafer cleaner or drier. Sikama International Inc., Santa Barbara, Calif. For free data, circle 204 or visit www.onlinecenter.to/ap.
Wafer Bump Reflow System
Integrated Wafer Bump Reflow is a thermal system for continuous 300 mm wafer processing that also acts as a bridge tool for 200 mm wafer processing. BTU International, North Billerica, Mass. For free data, circle 218 or visit www.onlinecenter.to/ap.
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Parallel Seam Sealers
Model 2300AE family of parallel seam sealers hermetically seals small to large packages (from 2 mm2 to 8 x 12″) with high yields. A Windows user interface also is provided with SECS-II/GEM software and high-speed SECS message services or host emulation. Solid State Equipment Corp., Horsham, Pa. For free data, circle 211 or visit www.onlinecenter.to/ap.
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Die Bonders
Models FMI-555E and FMI-555EU are manually operated epoxy and eutectic die bonders. Their linear X/Y platforms are adjustable, and have a 4:1 and 8:1 ratio. The systems include a microscope-attached LED illuminator, Nikon with ESD protection, and 10X eyepieces with adjustable height and viewing angles. F&K Delvotec Inc., Foothill Ranch, Calif. For free data, circle 201 or visit www.onlinecenter.to/ap.
Bond Tester
DAGE-4300 is a semiautomatic bond tester for bump shearing 300 mm wafers. After a semiautomatic alignment onto the X/Y stage, the operator can initiate a fully automated bump shear test routine. Dage Corp., Stamford, Conn. For free data, circle 203 or visit www.onlinecenter.to/ap.
High-volume Dispensing System
A mid-range, high-volume, in-line dispensing system, Axiom X-1010 reportedly is ideal for applications such as SMA, solder paste and electrically conductive adhesives. Configured with the company's patented DJ-2100 DispenseJet valve, the system's acceleration (1 g peak) delivers SMAs at rates in excess of 30,000 dots per hour. Asymtek, Carlsbad, Calif. For free data, circle 216 or visit www.onlinecenter.to/ap
Dispenser Calibration Unit
Dispenser calibration units automatically determine the X, Y and Z coordinates of the dispenser needle tip designed for 2,200 apm and 2,200 apm+ die bonders. The calibration process is said to be fast and automatic, eliminating manual setup errors, and increasing process control and machine availability. Datacon North America Inc., Trevose, Pa. For free data, circle 212 or visit www.onlinecenter.to/ap.
High-frequency Substrate
D2I2 (Direct Die Interposer Interconnect) substrate is a thin, coreless structure with high-frequency material characteristics, such as low dielectric constant, dissipation factor and moisture absorption. The substrate builds on the high-routing density technology of the company's existing UltraVia substrate product line. Kulicke & Soffa Industries Inc., Willow Grove, Pa. For free data, circle 214 or visit www.onlinecenter.to/ap.
Wire Bonding Wedge
A vertical feed, deep access wedge for Westbond wire bonders features an easy to thread deep countersink and a smooth bore internal finish. A unique relief design is to be optimized mechanically and ultrasonically for Westbond vertical feed wire bonders. Gaiser Tool Co., Ventura, Calif. For free data, circle 209 or visit www.onlinecenter.to/ap.
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