Tegal Joins APiA, The Advanced Packaging and Interconnect Alliance

PETALUMA, Calif., July 16, 2002 – Tegal Corporation (Nasdaq: TGAL) today announced that it has been accepted as an associate member of the Advanced Packaging and Interconnect Alliance (APiA), further exemplifying Tegal’s commitment to serving the needs of the packaging applications market. Tegal’s membership also strengthens APiA’s role as the IC packaging industry’s leading authority on advanced packaging and interconnect technology.


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