Tessera and Taiwan-based Walton Advanced Electronics Ink New Licensing Agreement

As part of the agreement, Tessera will also provide the memory-chip test and assembly company access to Toshiba Corporation’s process technology for volume production of Tessera’s wire-bonded µBGA(r) package. This is the first Toshiba process technology sublicense granted by Tessera since the two companies signed an expanded licensing and technology agreement in May 2002.

Breakthrough Technology Delivers up to Eightfold Increase in Memory Density while Significantly Driving Down Stacked Package Costs


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