Tessera Introduces µZ-Ball Stacked Memory Package for Computing and Portable Electronic Products

SEMICON West, SAN JOSE, Calif. – July 17, 2002 – Tessera Technologies, a premier developer of intellectual property and services for chip-scale and multi-chip packages, today announced the newest addition to Tessera’s µZ(tm) technology family, the µZ-Ball Stacked multi-chip memory package. Original equipment manufacturers (OEMs) and memory module manufacturers can now stack up to four DRAM chips into a single multi-chip package. The result is a sizeable increase in memory capacity-nearly eight times that provided by alternative technologies currently available, such as thin small-outline packages (TSOP).

Cham/Switzerland, July 17, 2002 – ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, announces the introduction of a 5 µm Die Attach solution on its Micron 5003 Die and Flip Chip Attach Machine. This tool fulfills an important request from ESEC’s customers and will insure more accurate bonding performance and overall superior results.


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