Universal Reveals New Flip Chip Capabilities

The enhanced flip chip option provides the ability to easily process wafers of any size including 300mm. These improvements increase flexibility so that flip chips and bare die can be processed with minimum changeover time. This enables semiconductor manufacturers to run multiple die attach processes on the same machine with minimal engineering or operator intervention.

IMEC’s new Reliability Center invites industrial partners and research centers to collaborate in the area of reliability and failure physics on the basis of shared cost, risk and IP.


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