AMD, UMC to collaborate on 300mm APC technology

Sept. 9, 2002 – Taipei, Taiwan, and Sunnyvale, CA – AMD and UMC plan to jointly develop advanced process control (APC) technology for cost-effective, high-volume 300mm semiconductor manufacturing.

APC technology automates complex processes in high-volume semiconductor manufacturing to help minimize costs, maximize productivity, ensure consistently high levels of quality, and facilitate real-time adjustments to any part of the manufacturing process.

This technology is expected to enable higher revenues/wafer and lower manufacturing costs.

AMD and UMC will implement the jointly developed APC technology at the two companies’ joint-venture 300mm semiconductor manufacturing facility in Singapore, Au Pte., which is currently expected to begin production in 2005. This technology will also be implemented at UMC’s other 300mm facilities, including Fab 12A in Taiwan, which is currently in volume production for a number of UMC customers.


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