Sept. 23, 2002 – Fremont, CA – ChipPAC Inc., a provider of semiconductor assembly and test services, and Advanced Semiconductor Manufacturing Corp. (ASMC), Shanghai, China, an analog and power wafer foundry company, have formed a new alliance to support customers in the analog and power markets.
The alliance will deliver a more competitive manufacturing and time to market business model to
semiconductor device manufacturers, the companies said.
Under the non-exclusive alliance, ASMC and ChipPAC will provide customers with end-to-end solutions from wafer fab to wafer sort, packaging, final test, and distribution in China, as well as the global market. The companies have worked together for nearly a year and have already established the logistics of an effective turnkey supply chain, they said.
ChipPAC and ASMC both recently announced expansion plans in China.
ChipPAC’s capacity with the construction of a new manufacturing facility and full equipment operating over time will be in excess of 100 million units/week in China.
Separately, ASMC started construction of its Fab 3, a 200mm wafer facility, which will commence production in 2003. ASMC now operates a 5-in. fab and a 6-in. fab, and with the addition of 200mm fab, ASMC expects its total wafer fab capacity will reach 100,000 wafers/month.
For more information, see www.chippac.com