Sept. 18, 2002 – South Portland, ME – Fairchild Semiconductor, a global supplier of high performance power products for multiple end markets, has opened a Package and Technology Knowledge Center in Bucheon, South Korea.
The center will research new packaging materials to improve thermal and mechanical performance and develop new assembly techniques, working closely with global Fairchild engineering and manufacturing groups.
“A major focus of Fairchild’s development efforts is to miniaturize components for a broad range of customer applications. We’ve also taken the lead in developing an innovative system in a package approach for both high and low power applications that enables multiple products to be designed cost effectively within a single module,” said Don Desbiens, VP of technology development at Fairchild Semiconductor.
“Our presence in Korea encompasses development, manufacturing, sales and distribution. Adding advanced packaging capabilities will strengthen the company’s team in Korea and impact our development efforts worldwide. Staffed by a skilled and motivated team, we expect to see the fruits of this work in new products starting in 2003,” Desbiens said.