IBM Introduces New Technology, Collaborations

EAST FISHKILL, N.Y. – IBM announced its second-generation “surface laminar circuit” (SLC) flip chip packaging technology, as well as agreements with Amkor Technologies, ASAT Holdings Ltd. and Advanced Semiconductor Engineering Inc. to provide the technology for their customers.

IBM's SLC substrates are based on its “build-up” technology currently produced in Yasu, Japan. IBM also will provide substrate design and modeling services.

The new substrates include laser-drilled microvias with diameters as small as 48 µm. Packages with these substrates have passed 1,000 temperature cycles (-55° to 125°C) and JEDEC Level 3 preconditioning. Prototypes featuring 150 µm C4 area-array pitch and 212 µm core pitch are planned to be available in Q4 of 2002.


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