Nanya, Infineon setting up 300mm joint venture

Sept. 6, 2002 – Taipei, Taiwan – Nanya Technology Corp. and Infineon are scheduled to jointly set up a new semiconductor company at the end of this month to produce 300mm wafers.

Nanya and Infineon will each hold an equal share in the joint venture. Initial production capacity is set to be 20,000 wafers/month. But the output for single modules can go up to 50,000 wafers, reported the Financial Times.

The team-up of the two companies will allow them to enhance each other on the increasingly competitive world market. Infineon will soon upgrade its office in Taiwan to a branch company and the company has increased the number of engineers working in Taiwan.


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