NEXX Systems Joins SECAP

MUNICH – NEXX Systems, an advanced packaging equipment supplier, joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP). NEXX Systems adds under bump metallurgy (UBM) and backside metallization to SECAP's portfolio, replacing the capability supplied by Unaxis until it resigned from SECAP to join the Advanced Packaging and Interconnect Alliance (APiA).

According to Richard Post, Ph.D., CEO of NEXX Systems, its deposition tool, Nimbus, “is a unique tool, the first designed specifically for UBM, backside metallization and high-density substrates for the advanced packaging market.”

Post and Michael Gustafson, director of sales and service at NEXX, told Advanced Packaging that its deposition equipment is about half the cost per wafer of other tools on the market. They cited the fact that it was specifically designed for packaging applications, giving it cost benefits over front-end equipment being pressed into service in the back end.


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