SEMICON West Headlines

SAN JOSE, CALIF. – Below are some of the many press releases announced during SEMICON West. Visit the Advanced Packaging Web site at to find links to all these and other stories from SEMICON West.

  • Adept Technology Chosen as New Automation Member of APiA
  • Advantest Driving Formation of Industry-wide Consortium Aimed at Establishing First Truly Open Test Architecture
  • Agilent Technologies, ACCRETECH and Cascade Microtech to Provide New Cost-saving Parametric Test Solution
  • Amkor and Unitive Form Manufacturing Alliance for Asian Supply Chain
  • August Technology Enhances Wafer Bump Inspection Product Family
  • ChipPAC Engineers System Package for High-performance Applications
  • Cookson ElectronicsSemiconductor Products Introduces No-Flow Underfill for Flip Chip Applications
  • Coreco Imaging Announces High-performance, 64-bit Camera Link Frame Grabbers
  • ESEC Introduces Revolutionary Bondhead Technology at SEMICON West
  • Fujitsu Microelectronics Introduces Industry's Smallest Chip-size Module with Advanced System-in-Package Technology for Mobile Systems and Consumer Electronics Products
  • IMEC Sets up New Center of Excellence in Reliability
  • KINESYS Announces Latest Version of Assembly Line Production Supervisor (ALPS) Software for Back-end Process Automation
  • Kulicke & Soffa Announces D2I2, A Coreless, High-density, High-frequency Substrate
  • Mühlbauer Showcases Successful High-speed Die Sorter at SEMICON West
  • n&k Technology Inc. Announces Metrology Tool for Characterizing Ultra-thick Photoresists
  • Newport Corp. to Introduce New MRSI-375FC Flip Chip Bonder at SEMICON West
  • Palomar Technologies Introduces the Gold Connection for Gold Ball Bump and Flip Chip Thermocompression Bonding
  • phoenix|x-ray Unveils Industry's First Back-end Inspection Roadmap
  • SECAP to Install 300 mm Bumping Line in Asia Open to the Industry
  • SEMI Announces Mid-year Consensus Forecast for Chip Equipment Industry
  • SUSS MicroTec Introduces Mask Aligner for 300 mm Packaging Applications at SEMICON West
  • Tegal Joins APiA, The Advanced Packaging and Interconnect Alliance
  • Tessera Introduces µZ-Ball Stacked Memory Package for Computing and Portable Electronic Products
  • Ultratech CEO Arthur W. Zafiropoulo Elected SEMI Chairman
  • Universal Reveals New Flip Chip Capabilities



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