Sept. 9, 2002 – Hsinchu, Taiwan – Taiwan Semiconductor Manufacturing Co. (TSMC) has filed an application with the Taiwanese government to build an IC fab in Shanghai.
TSMC plans to invest a total of US$898 million (US$1=NT$34.254), in which US$842 million will be used for the purchase, transportation, and installation of machinery and equipment, reported Dow Jones.
The investment is scheduled to be completed in four years.
The new company, which will 100% owned by TSMC, is temporarily named TSMC (Shanghai) Corp.
TSMC plans to build a 200mm fab with a target monthly capacity of 35,000 wafers. It has filed an application with the Investment Commission of Taiwan’s Ministry of Economic Affairs.
An official at the Investment Commission said it may review TSMC’s application for the plant at its monthly meeting in October at the earliest.
The company has also officially filed an application in China for the fab, which will be located in Songjiang Science Park, making it the first-ever application from a Taiwanese foundry-maker to establish a plant in the mainland.