Oct. 17, 2002 – San Jose, CA — Tessera Technologies Inc., a provider of chip-scale and multi-chip packaging solutions, has expanded the scope of an existing licensing agreement with Hitachi Ltd.
Hitachi, one of Tessera’s first licensees for advanced packaging technology, has been a licensee of Tessera technology for semiconductor packages with the device in a face-down orientation since 1994. The expanded licensing agreement between Tessera and Hitachi includes semiconductor packages with devices in the face-up orientation, commonly referred to as fine-pitch, small-format BGA packages, also marketed by Tessera as µBGA-FTM packages.
Hitachi utilizes these packages for many core products, including logic and ASIC devices, which are used in a variety of mobile communication, consumer, and computing applications.
Chip-scale packages provide value to the high-technology industry by enabling smaller products that offer higher performance and greater reliability than those using conventional semiconductor packages. As their name implies, chip-scale packages deliver packaged semiconductors that are virtually the same size as the unpackaged semiconductor devices themselves.
Tessera’s intellectual property can be utilized in many forms of chip-scale packaging, employing a range of materials and assembly processes. Tessera licenses its intellectual property broadly to semiconductor companies, assembly companies, and the infrastructure companies supporting the semiconductor industry.