U.K. REPORT

BY JEFFREY C. DEMMIN

As the premier technology source for advanced IC packaging, Advanced Packaging Magazine is dedicated to uncovering the latest research and technology for our global audience. We strive to help engineers and decision-makers in the packaging industry excel at their jobs by offering a unique mix of cutting-edge processes and new technology initiatives. We do this by focusing on materials, design, assembly and reliability, and by encouraging peer collaboration industry-wide.

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