Reactive NanoTechnologies extends first round

Dec. 27, 2002 — Reactive NanoTechnologies Inc., a Baltimore-based developer of nanostructured foils for joining materials, extended its first round of venture funding with a $400,000 investment from Silicon Alley Seed Investors (SASI), according to a news release.

The funds will be used for sales, marketing and product development efforts. SASI partner George Abraham was also named to Reactive’s board.

Reactive NanoTechnologies previously closed its first round financing in late June with a $2 million investment. The company’s foils melt braze — a hard solder with a high melting point — using a chemical reaction in order to join materials without using an industrial furnace.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.