SUSS launches nanoimprinting tools

Dec. 12, 2002 — SUSS MicroTec AG said it has launched new embossing equipment for nanoimprinting technology.

The Munich-based firm said it has developed three tools, the FC 150 Device Bonder, MA6 Mask Aligner and SB6 Substrate Bonder, for nanoimprinting, a technique using nanoscale patterns to stamp or print designs on chip surfaces. The technique produces smaller device features and is quicker and cheaper than conventional lithographic methods, according to a company release.

Potential applications include bioMEMS, optical microsystems and nanotechnology, the release said.

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