Dec. 30, 2002 — Trikon Technologies Inc. has introduced a new DSi module for high rate, anisotropic, deep silicon etch processes for the fabrication of microelectromechanical systems (MEMS).

The DSi is a new module based on Trikon’s patented M0RI helicon plasma source, the company said in a news release. Silicon etching is strongly dependent on the partial pressure of reactive species and the gas flow. For this reason the DSi(TM) module has been specifically designed to promote highly efficient gas dissociation and operation at a higher pressure than conventional helicon sources, it said.

“The MEMS community has been waiting for an equipment supplier that can address not only the technical aspects of the process at the development level but who also understands issues relating to high volume manufacturing,” Dave Thomas, etch product marketing manager, said in the news release. “Trikon has been selling production equipment to the semiconductor industry for 35 years and understands the importance of high productivity, a tailored approach to customer support and a global infra-structure.Trikon is in a strong position to capitalize on the predicted growth of the MEMS industry as it matures to production levels at high volume.”