Jan. 8, 2003 – Sunnyvale, CA, and East Fishkill, NY – AMD and IBM have entered into an agreement to jointly develop chipmaking technologies for use in future high-performance products.
The new processes will be aimed at improving microprocessor performance and reducing power consumption, and will be based on advanced structures and materials such as high-speed SOI transistors, copper interconnects, and improved low-k dielectric insulation.
The agreement includes collaboration on 65- and 45nm technologies to be implemented on 300mm wafers.
“We are set to commence production of our 90nm solutions in 4Q03, so we are now expanding process-technology development efforts for our next-generation of processors targeted at 65nm and below,” said Bill Siegle, senior VP, technology operations and chief scientist at AMD.
AMD and IBM will be able to use the jointly-developed technologies to manufacture products in their own chip fabrication facilities and in conjunction with selected manufacturing partners. The companies expect first products based on the new 65nm technologies to appear in 2005.
Development will be supported by AMD and IBM engineers working together in IBM’s Semiconductor Research and Development Center in IBM’s East Fishkill, NY facility.
Work is expected to begin by Jan.30.