ISMT and UAlbany close deal on EUV lithography program

Jan. 28, 2003 – Austin, TX, and Albany, NY – The U. at Albany (UAlbany) and International SEMATECH (ISMT), a global consortium of semiconductor manufacturers, have completed negotiations on a joint five-year program to accelerate the development of next generation lithography.

Under the terms of the contract, ISMT will conduct a program in EUV lithography infrastructure, focused on advanced work in three areas — mask blanks, resist, and EUV extensions — at UAlbany’s new 300mm wafer cleanroom complex. The program is designated as International SEMATECH North.

The UAlbany/ISMT agreement stipulates that ISMT will provide technical program definition, execution, management, and staffing, while UAlbany will provide facilities, staffing, and funding leverage. Both entities will share in the executive management of the program and the procurement of equipment, materials, and contract R&D as defined by the ISMT management team.

Initially, ISMT will send a project team of about 10 people to Albany to oversee the start-up; ultimately, the program is projected to include 30 ISMT employees and assignees, and involve over 500 UAlbany and other university faculty and staff, national laboratory and industry scientists and researchers, and material and equipment supplier engineers and technicians.


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