UMCi begins equipment move-in at 300mm fab

Jan. 22, 2003 – Singapore – UMCi, the Singapore-based 300mm joint venture between UMC, Infineon Technologies AG, and EDB Investments (the Singapore Economic Development Board’s investment arm), said that equipment move-in has begun for the fab, beginning with copper processing equipment from US-based Applied Materials and Japan’s Tokyo Electron Ltd.

This milestone signifies the beginning of UMC’s operation in Singapore.

UMCi is located in the Pasir Ris Wafer Fab Park and was first announced in December of 2000. Total planned capacity for the facility is 40,000 wafers/month and overall investment is expected to be US$3.6 billion. Current installation will primarily focus on copper backend processing equipment, with frontend equipment expected to follow later this year as market conditions require.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.