Mattson divests wet business unit

Feb. 13, 2003 – Fremont, CA – Mattson Technology Inc., a supplier of advanced process equipment used to manufacture semiconductors, has signed a definitive agreement to sell its wet products division to SCP Global Technologies, a wet processing equipment provider.

The sale, which is subject to certain closing conditions, is anticipated to close in the first quarter of 2003.

The transaction involves the transfer of certain subsidiaries, assets, and IP related to the wet products division.

As part of the transaction, Mattson Technology will retain the rights to all future royalty and settlement payments under previously announced agreements with Dainippon Screen Manufacturing Co. Ltd.

“The divestiture of our wet products division is a component in the strategy we adopted in 2002 to focus on driving core technologies,” said David Dutton, CEO of Mattson Technology.

In connection with this transaction, Mattson Technology and SCP are in discussions to form a strategic alliance to develop integrated cleaning technologies for transistor formation, post-etch and implant process wafer cleaning, and pre-thermal wafer process cleaning. Under the alliance, Mattson and SCP will cross license IP.


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