Epoxy Adhesive
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EPO-TEK T6117 is a single-component thermally conductive epoxy adhesive designed for high-volume dispensing techniques. The adhesives reportedly can be cured at 180°C in 15 minutes with very low stress. Various properties are said to include ionic purity, high-shear strengths, high radius of curvature, low voiding on cure and low moisture absorption. Additionally, the epoxy adhesive has a working life of greater than four days and contains no solvents. Epoxy Technology Inc., Billerica, Mass. For free data, circle 209 or visit www.onlinecenter.to/ap.
Microtest System
Model 5848 reportedly is designed for testing microelectronics devices, MEMS, photonic and other small components, as well as combining high precision with a good cyclic performance. The design is said to include a rigid frame, capable of being used in either horizontal or vertical orientations, which ensures accurate and repeatable deformation measurements. Additionally, a specially designed encoder, mounted directly on the loading actuator, provides position measurement resolution of more than 20 nm. Instron Corp., Canton, Mass. For free data, circle 202 or visit www.onlinecenter.to/ap.
Bump Stepper
Saturn Spectrum 300e(2) features a dual-lamp illumination option and edge processing capabilities designed specifically to deliver the high yield, imaging and throughput performance required for advanced flip chip and WLP applications. The stepper reportedly is built from the company's Saturn Spectrum 300, incorporating new features. The dual-lamp illumination option reportedly provides significantly higher wafer-plane irradiance and throughput while exposing thick resists. The system's edge-processing option also provides both edge-exposure and exclusion capability to ensure the outer edge of the wafer is processed as needed and to maintain optimum throughput. Ultratech Stepper Inc., San Jose, Calif. For free data, circle 204 or visit www.onlinecenter.to/ap.
Singulation System
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The Water Jet Singulation System reportedly uses proprietary beam technology with an abrasive-filled water jet. The system is said to cut through materials at more than 160 mm/sec, as well as reduce the chipping along the saw street ..by more than 70 percent in comparison to saw singulation. The singulation system also is capable of handling small components down to 0.5 x 0.5 mm, and cuts to constant widths from 50 to 500 µm. Intercon Technology Inc., Morgan Hill, Calif. For free data, circle 203 or visit www.onlinecenter.to/ap.
Coating System
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PRISM Ultra-Coat system is a multi-application coating system platform that is based on proprietary Ultra-Spray technology from below the board fluxing to precision, selective topside coating. The system's head can be configured for ..each application and also is able to spray virtually any liquid, from thinner fluxes and solvents to thicker conformal coatings and adhesives. Additionally, the system has an 18 x 18″ spray application area and can be configured with a multi-zone conveyor for inline operation or a stand-alone system for batch operation. Ultrasonic Systems Inc., Haverhill, Mass. For free data, circle 206 or visit www.onlinecenter.to/ap.
Software Package
IFS Pro (Interactive Field Solver) is a software package developed for design engineers with high-speed analog simulation requirements involved in PCB, cable, connector, IC and related interconnect media design. The software reportedly is a full order Boundary Element Field Solver that combines the ease-of-use of a well-designed graphic interface with the accuracy of high-order boundary element electromagnetic field solver and SPICE simulator. Interactive Products Corp., Cary, N.C. For free data, circle 210 or visit www.onlinecenter.to/ap..
Copper/Tungsten Material
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This company is joining copper/tungsten to other metals such as Kovar. Parts reportedly can be machined to tight tolerances, electroplated and joined to other metals and ceramic by using various solder/braze hierarchies to form miniature heat sinks, subcarriers and other assemblies. Copper/tungsten provides coefficients of thermal expansion of 6.5 to 8.3 ppm/°K and thermal conductivity of 175 to 200 W/mK. The addition of a Kovar carrier and metallized ceramics to a copper/tungsten base plate adds laser weldability and flexibility of interconnect and test. L.E.W. Techniques Ltd., Somerset, United Kingdom. For free data, circle 207 or visit www.onlinecenter.to/ap.
Phase Change Material
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Powerstrate 51R is a reworkable phase change material for use between “lidded” microprocessors and heat sink assemblies. ..The thermal interface material is formulated for easy removal without thermal performance degradation, and also releases from either or both interface surfaces. The material reportedly delivers an ultra-low thermal impedance of 0.008°C in/W, and offers a phase change threshold of 51°C. Additionally, the material is said to offer good thermal properties without the problems associated with migration or thermal compound “pump-out,” and without the process hassles associated with grease. Henkel Loctite Corp., Rocky Hill, Conn. For free data, circle 211 or visit www.onlinecenter.to/ap.
Linear Actuators
Various motor-driven linear nanopositioning actuators reportedly provide resolutions of 25 to 100 nm, pushing forces to 30 lbs and speeds to 2″ per second. Some features include space-saving ultra-low friction designs, non-rotating tips for improved repeatability, and ball screws for high-speed actuation and extended lifetime. Polytec PI Inc., Auburn, Mass. For free data, circle 208 or visit www.onlinecenter.to/ap.
X-ray Sources
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High-definition X-ray sources are said to feature focal spot size as small as 0.5 µm to detect imperfections in printed circuits, components, semiconductors, ceramics and soldered parts. With a voltage range of 80 to 160 kV, the X-ray sources are said to cover a wide array of material densities. The small focal spot sizes are said to allow the X-ray sources to deliver images that are detailed and clear. Hamamatsu Corp., Bridgewater, N.J. For free data, circle 201 or visit www.onlinecenter.to/ap.
