Semi-automatic Screen Printers
The Viking-class Horizon 05 platform featuring fully automatic vision alignment has adjustable stencil mount and extensive networking capabilities. Viking-class machines will accept stencils up to 29 x 29″, and reportedly can be upgraded to pass-thru capability as business requirements evolve. Advanced options are said to include automatic paste dispensing, ProFlow, 2-D inspection with advanced optics and lighting. Vortex underscreen cleaning may be specified at manufacture or added later as machine performance upgrades. DEK, Zurich, Switzerland Booth 2225
Tessera Announces Symposium on 3D Packaging, Advanced Packaging Media Sponsor
SAN JOSE, CALIF.
As part of its ongoing efforts to educate and elevate awareness of advanced packaging technologies, Tessera Inc., a premier technology developer and services provider for chip-scale and multi-chip packages (CSPs and MCPs), announced it will host a half-day symposium on 3D packaging technologies during the week of SEMICON West 2003. Speakers and panelists will include a number of leading technologists from premier companies throughout the electronics manufacturing, assembly, and packaging supply chain.