Getting to Know You

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Many of you may already know me, perhaps under the name of Gail Stout, since I've been the editor-in-chief of SMT Magazine for many years. Now that Jeff Demmin, the former editor-in-chief of AP, has stepped back into the packaging industry, both SMT and AP will fall under my editorial direction. However, we are thankful that Jeff will remain active with AP as a member of our Advisory Board and contributing author.

Now that you know a bit about me, it's time for me to learn about you. The first responsibility of any editor is to get to know the readership. We are here to serve your needs, delivering the most current information available. As the industry has changed, so do your needs as packaging engineers. Every week on AP 's Web site ( we post a Quick Vote to get to know our readers better. Because there are more than 25,000 readers, talking to each of you will take a while, but to see how you respond to our industry questions gives us an idea about where you stand on current issues.

Here are some interesting results from AP 's Quick Vote. Most of our readers are optimistic about the semiconductor packaging industry rebounding this year; however, most also answered that they are somewhat nervous about what's happening in their particular neck of the woods. Still, most of those responding to the heath of the semiconductor industry said that packaging would be better next year, indicating a positive feeling about where we're headed. However, when asked, “What do you think of the optimism recently shown by semiconductor industry analysts?” most answered that the analysts “haven't a clue.” At least we're all feeling positive.

On the technology side, Quick Vote revealed the following facts and opinions:

  • Lead-free assembly issues are of great importance to many companies.
  • Wire bonding will cease to be the dominant method for connecting semiconductor chips in five to 10 years.
  • The work of packaging groups SECAP and APiA is of great interest.
  • Wafer-level packaging is a stable market.
  • Optoelectronic packaging is of growing importance.
  • MEMS are used in the workplace more often.
  • Half of our readers use low-temperature co-fired ceramics (LTCC) in their work.

I'm eager to talk to you, to present your expertise in print and to provide the latest information available. As traditional packaging technologies shape up into wafer-level developments and as systems packaging shifts into nanopackages, I'll be excited about your thoughts on the matter. Contact me with your ideas anytime.

Gail Flower


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