On-wafer Probe
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Infinity Probe is an on-wafer probe that reportedly offers both high-frequency performance and low-stable contact resistance on aluminum pads (typically <0.1 Ω). The probe is said to combine the company's proprietary thin-film technology with coaxial technology, resulting in a probe with a good electrical and mechanical performance as compared to conventional RF probes. Cascade Microtech Inc., Beaverton, Ore.
Small Footprint Package
The SOT66x package reportedly provides a smaller footprint and lower profile than the company's SC70, which is the nearest size similar package. The package footprint area is 2.7 mm2 and the thickness is 0.57 mm as compared to an area of 4.2 mm2 and a thickness of 0.95 mm for the SC70. The packages also are said to meet MSL-1 at 260°C reflow and are available in a six-lead version. Carsem Inc., City of Industry, Calif.
Thermal Interface Material
THERMSTRATE TC is an advanced formulation phase change thermal interface material for use between heat sinks and various heat dissipating components. The thermal interface material reportedly flows at a 60°C phase change temperature, providing 100 percent wetting at the interface and conforming to the surface of the heat sink and component. Upon flow, the compound's volume also expands by 15 percent, expelling trapped air pockets from the interface and eliminating interstitial voids that penalize performance. Henkel Loctite Corp., Rocky Hill, Conn.
Leak Test System
NorCom 2020 optical leak test system provides automated, in-line, full matrix gross- and fine-leak testing performed simultaneously on up to 200 hermetic devices. The system uses digital holography to measure small changes in package stiffness due to gross or fine leaks when the packages are placed on trays in the helium pressure cell. The test system is said to eliminate back-end production bottlenecks by automating the leak test process. NorCom Systems Inc., Norristown, Pa.
Chip Shooter
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The 4797S HSP machine reportedly features a footprint of 2,400 x 1,963 x 2,155 mm and the ..capability of handling PCBs up to 250 x 330.2 mm. Its components handling range is said to cover 0201s to 26 mm2 parts, as well as area-array packages. Its maximum placement speed also is said to be 48,000 components per hour. Universal Instruments, Binghamton, N.Y.
Design Guide
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The MOSFET BGA design guide provides detailed information on the physical characteristics, performance advantages and qualification data for the company's complete line of PowerTrench MOSFET BGAs. The fully illustrated, four-color, 36-page guide offers circuit board design and layout recommendations, mechanical specifications, and guidelines for mounting BGA power packages. Fairchild Semiconductor International, South Portland, Maine.
Thick Film Plating Resist
Shipley BPR-100 is said to be a thick film plating resist for wafer bump imaging applications, which features a nominal 1:1 resolution with standard coating, imaging and developing tools. The plating resist reportedly is an integral part of the complete line of bump formation processes available from the company that includes tin/lead, lead-free and gold bump electroplating products and advanced dielectrics for bump redistribution. Shipley EIF, Electronic and Industrial Finishing Div. of Shipley Co. LLC., Freeport, NY.