Elpida nabs 30mm fab funding

June 24, 2003 – Elpida Memory says it has secured $425 million in funding to expand production at its 300mm wafer fab in Hiroshima, Japan.

Elpida expects to raise $687 million for the fab project, including $100 million from Intel and $80 million from each of its two parent companies, Hitachi Ltd. and NEC Corp.

The 300mm fab is key to Elpida’s plans to grab 15% of the global DRAM market share by 2006, up from the 5.1% share it held in 2002.


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