Formosa expanding IC packaging capacity

June 20, 2003 – Taipei, Taiwan – Formosa Advanced Technologies Co. plans to expand its business for packaging and testing consumer ICs and memory IC modules this year, according to the Taiwan Economic News.

Formosa will add packaging and testing equipment of ICs based on 12-in. wafers this year, and establish a production line of memory IC modules, with completion scheduled for 3Q03.

Nearly two-thirds of Formosa’s total revenues comes from IC packaging services, with the remainder in IC testing services.


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