June 26, 2003 – Three semiconductor manufacturers are planning to invest over $1 billion to build IC chip plants in Shanghai, according to Interfax.
Malaysia’s Ultimate Semiconductor is building a facility in the Jiading district to produce 6-in. wafer using 0.35-micron technology, with plans to expand to 8-in. wafer production based on market demand. The plant will have a maximum annual production capacity of 600,000 wafers, with trial operations scheduled to begin in June 2004.
Also, Shanghai’s Qingpu Science Park says it has reached a $500 million agreement with a US firm to build a plant for producing 6-in. wafers and eventually 8-in. wafers. In addition, Singapore’s United Test and Assembly Center Ltd. (UTAC) said it plans to invest $100 million in a plant in Shanghai.
The three deals follow on the heels of a similar announcement two weeks ago by Taiwan’s TSMC to build an $898 million, 8-in. wafer fabrication plant in Shanghai’s Songjiang district.