SEMI publishes 13 new standards

June 2, 2003 – San Jose, CA – SEMI has published 13 new technical standards relating to important aspects of semiconductor and flat panel display manufacturing.

Included in the new standards are best practices for welding of fluid distribution systems in wafer fabs, provisional specifications for XML message structures, guidelines for calculating overall factory efficiency (OFE), and measurement methods for optical characteristics of flat panel display backlight units.

SEMI Standards are published three times a year. The 13 new standards, part of the July 2003 (0703) publication cycle, join more than 620 standards that have been published by SEMI during the past 30 years.

The new standards, developed by industry experts from equipment suppliers, device manufacturers, and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website,


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