June 23, 2003 – SUSS Microtec, a supplier of production, process, and test technologies, has introduced a new line of lithography technologies for use in wafer-level packaging, MEMS, and optoelectronics.
Collectively called SupraYield, the set includes mask pellicle technology, a mask aligner, advanded photoresists and large clearfield mask movement.
SupraYield is designed to expose the entire wafer in one step, increasing throughput and reducing costs for lithography systems.