Ultratech adds metrology to nanotechnology offerings

June 18, 2003 – San Jose, CA – Ultratech (formerly Ultratech Stepper) has added a new metrology system to its nanotechnology initiative.

The UltraMet 100, measures the alignment of images on a wafer, for any or every die on a wafer. It is optimized to work in conjunction with Ultratech’s Nanotech 160 dual-side-alignment stepper, to offer wafer-handling automation for high-volume MEMS and nanotechnology processes.

Availability is scheduled for 4Q03, with initial target markets to include R&D and pilot production applications.


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