Winners were chosen for their innovative product contributions in the following 14 categories: die placement/molding; encapsulation/molding; flip chip processes, materials and products; functional test equipment; handling equipment/fixtures; imaging/inspection equipment; package design and analysis; quality management tools; specialized advanced packaging products; substrate and submount materials and technologies; surface treatment equipment; thermal management; wafer dicing/thinning; and wire bonding.

During SEMICON West in San Jose, Calif., it was announced that unit volumes are up along with utilization and capacity in electronics. “Final manufacturing is leading the rebound,” said Dan Tracy, director of industry research and statistics for SEMI. SEMI consensus figures projected a four percent growth for the industry this year from the $19.8 billion posted in 2002, and a 24 percent growth next year. Packaging, assembly and test make up the strongest indicators of this projection.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.