AMAT, TSMC collaborate for copper chips

July 14, 2003 – Applied Materials and TSMC have entered into a joint development agreement to develop TSMC’s copper chips on AMAT’s SlimCell electrochemical plating system.

The ECP system design, which links plating cells to individual chemical tanks which are replaced after processing a set number of wafers, aims to halve the chemical cost per wafer over conventional large bath systems.


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