July 14, 2003 – Assembly and test services provider ChipPAC says it is ramping up production of PGBA packages in its China facility.

The PBGA production processes are copied from ChipPAC’s facility in Korea, which to date has shipped more than 300 million PBGAs. The plant was qualified late last year to manufacture ChipPAC’s PBGA package assembly, and recently completed qualification for several ChipPAC customers.

ChipPAC hopes the increased production of substrate-based products will gain traction in China, where PC shipments grew 27% in 2002 and are expected to continue double-digit growth in 2003.