LSI Logic inks deal with TSMC

July 7, 2003 – LSI Logic Corp., Milpitas, CA, says it will contract with TSMC to build chips using 0.11-micron and 90nm processes.

The contract, which will account for over 70% of LSI’s outsourced chips, represents 25% of the company’s total chip output; a company representative says LSI plans to boost outsourcing volume to half its total output.

LSI and TSMC will begin using 0.11-micron copper interconnect processes on volume-production chips beginning this month.

The deal is seen by analysts as a competitive move against IBM, which recently won manufacturing business from former TSMC customers Analog and NVidia.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.