Philips expands operations in Shanghai

July 31, 2003 – Royal Philips Electronics NV, Amsterdam, The Netherlands, and Advanced Semiconductor Manufacturing Corporation (ASMC) have expanded their joint venture include a new $687 million semiconductor manufacturing facility, according to Dow Jones.

The line is now entering trial production, and will produce 30,000, eight-inch wafers per month at full capacity, although Philips hasn’t said when that will occur. The plant will initially cut 0.25-micron chips, and will upgrade to 0.18-micro next year. Company president Liu Youhai says the plant has already received orders from four customers.

The joint venture, established in 1988, already operates two lines producing 5-in. and 6-in. wafers.

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