Ricoh to boost wafer capacity

July 7, 2003 – Ricoh plans to spend 7 billion yen ($59 million) to boost monthly production capacity in its 200mm wafer plant in Yashiro, Japan by more than 15%. The increase from 5,500 wafers to 6,500 wafers will address growing demand for power management chips used in mobile phones.

Ricoh will upgrade its facilities for power-management chip production with a circuit line width of 0.35-microns, and also beef up its facilities for producing image-processing system chips used in digital copiers.


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