July 18, 2003 – Robotic Vision Systems Inc. (RVSI), Nashua, NH, has unveiled two new tools for bumped wafer inspection, as well as a pair of tools to enhance its lead scanning systems.

The “RampNow” tool is a retrofit kit aimed at improving throughput at RVSI’s end-of-line inspection systems by 35-40%. The second tool, “Multi-Mark”, enables the inspection of marks on multiple devices at the same time, providing up to a four-fold boost in capability.

“This is the kind of performance improvement that demonstrates the innate superiority of in-tray inspection over pick-and-place systems,” said Michael Gray, VP of sales for RVSI’s semiconductor equipment group.

The company has also released a Defect Review tool, which lets users of its WS-series bumped wafer inspection systems review defects offline during wafer inspection. The Process Commander tool, meanwhile, allows users to review data from multiple WS-series systems to analyze processes and identify trends.