Samsung to build 300mm wafer line

July 7, 2003 – Samsung Electronics says it will complete a 300mm wafer line at its chip plant in Hwaseong, Korea by the end of this year, ahead of the initial deadline set for 2004, according to the Korea Herald.

Samsung has invested a total of $1.2 billion in the line, and plans to pour another $1.2 billion into the plant by the end of this year, the company said. When fully operational, the facility will pump out 32,000 wafers per month.

Samsung is reportedly already planning another 300mm wafer line at the Hwaseong plant.


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