SEMI WEST NEW PRODUCTS (PART 1 OF 3)

CSP Solution
A CSP solution for highly integrated radio frequency (RF) modules, the Pyxis platform reportedly integrates RF devices with their surrounding circuitry while delivering cost, height and area savings for more feature-rich, low-cost wireless electronics products. The solution extends the reach of CSP technology to tackle RF integration challenges. Combining several technologies (µBGA, flip chip, EMI shielding techniques and more), the platform is said to overcome size, reliability, performance, thermal and noise isolation challenges currently impending higher levels of RF integration.
Tessera Technologies Inc.

Exhibitor

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