K&S Announces a Volume Purchase Agreement with National Semiconductor
BY GAIL FLOWER

Flip Chip Bonder
Assembl&#233on’s D9 has a low-maintenance linear motor H-drive gantry coupled with a modular, open architecture, and can handle up to 75 die from myriad media. A direct drive, closed-loop Z-axis design provides consistent bond line thickness and the ability to stack die. In addition, the same system affords a programmable placement force from 90 to 4,000 gf, with selectable placement forces down to 6 gf. According to company claims, it has a flip chip throughput rate of 2,700 cph with 9 &#181m @ 3 sigma and a 3 ppm placement yield.
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